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P(B = b | A = aobs ) P(B = b | C = cobs ), P(B = b)

Discoveries Requiring Inspiration and Perspiration One of the valid concerns related to future technology development is the possibility that Moore s Law may be dissipated in the near future The technical and physical obstacles that loom ahead are of concern How complex can chips become is an open question One problem is power leakage as chips become more power hungry Chips with billions of transistor can leak up to 70 watts of power, causing cooling problems In addition, it is possible that circuit dimensions cannot get much smaller than the current 65 nanometers without increasing production dif culties In 2004, we were mass producing the 90-nm IC By 2006, migration to 65 nm began Changing from 90-nm to 65-nm design rules was quick because it required no changes in the fabrication process Back in 1988, IBM fabricated the world s smallest transistor at that time using 70-nm design rules.

It ran on a power supply of only 1 volt rather than the usual 5 volts, but required nitrogen cooling Today these eld effect transistors (FETs) run at room temperature In late 2003, NEC built a FET with a 5-nm gate length and IBM built one with a 6-nm gate length These are 10 times smaller than what s used in production now So we already know that transistors will work at scales that are an order of magnitude smaller than today s technology Instead of focusing on acquiring more speed from a single processor, which could be a dead end, innovators are also developing multicore processors: microprocessors using four to eight parallel cores By working in parallel, the total throughput of the processor is greatly increased Dual and quad cores are already being produced commercially Parallel advances in hardware will optimize the threaded software of network services.

Discoveries Requiring New Proof of Principle What about extending Moore s Law If we reach a physical limit to Moore s Law, we will require new discoveries in breakthrough phenomena demonstrating new proofs of principle The following are some of the leading candidates 3D Molecular Chips One alternative is building 3D chips, in which layers of transistors form a high rise12 New technologies that could lead to molecular three-dimensional computing include nanotubes, nanotube molecular computing, and self-assembly in nanotube circuits Matrix Semiconductor, Inc is already building three-dimensional circuits using conventional silicon lithography13 They are manufacturing memory chips with vertically stacked planes..

In their work the Group may need to take into account the following factors: 1. Management characteristics (How do stakeholders de ne and approve strategic direction How is the work-programme de ned and approved to carry out the strategic objectives ) 2. Business model (How are regional priorities, based on their business model, de ned such that the standards are truly global ) 3. Financial model (How are overhead costs assigned ) 4. Operating principles (How is actual standardisation work carried out How are the standards approved in different regions/countries ) 5. Maintenance work (How are improvements, maintenance of standards performed ) 6. European fall-back (What is the fall-back solution for Europe if there are disagreements at

their offerings and provided the customer with some form of decryption equipment (usually within a set-top box), which, conveniently can act as a host for creating a backward channel. The simplest way to use such a box is to enable it to make telephone calls to a payment centre for pay-perview purposes, but other alternatives are also available. We look further at the set-top box in the chapter on Retail Terminals. What is important to note here, is that interactive television may provide a serious rival to the home computer in the eCommerce environment, being cheaper, more user-friendly and possessing a high-speed download channel.

So the variance is var[x] = E[x2] x2 = 25.5 (4.5)2 = 25.5 20.25 = 4.25 Note that the variance we obtained from the 12-toss example (see equation A.6) is slightly different (4.992). The standard deviation for our uniformly distributed variable is: